Research and development of a new plasma activated ALD deposition system with a unique source of low-temperature plasma based on a microwave surfatron and ECWR discharge.

Development of a prototype plasma activated ALD reactor using unique plasma sources for deposition and etching of thin layers on substrates up to 300 mm in size: - ALD reactor design using the know-how of a Korean partner and its fluid dynamic modeling for optimization - Implementation of plasma systems with MW surfatrons and ECWR in ALD reactors based on theoretical and experimental results of plasma parameters - Remote PE-ALD application for deposition of at least one type of ALD layers