Grain boundary segregation occurs during thermal treatment and results in formation of thin layers of different composition compared to the base material which is spread continuously throughout a device. This often results in loss of cohesion in these regions and in embrittlement of the device which is extremely dangerous in applications. The book describes in detail the grain boundary segregation in metallic materials from theoretical point of view through its determination and effects of various variables on its level up to its relationship to macroscopic properties such as intergranular embrittlement and corrosion, and to new concept of "grain boundary engineering" utilizing anisotropy of grain boundary properties to obtain optimized properties. As the book summarizes all aspects of this phenomenon it is very useful material for students as well as source of numerous data for researchers: this is documented by steadily increasing number of citation of the book in scientific papers.
