Abstract
The project is focused on how to utilize the high energy/high power lasers for grinding of the SiC. The grinding of SiC surface is processed with diamond wheels, Due to the hardness of SiC (9.5 Mohs compared to 10 Mohs of diamond) the removal rate is relatively low and SiC removal rate is similar to the diamond wheel wear. We will develop a new laser grinding method that will reduce process costs with promising potential for yield improvement, especially due to reducing wafer warpage. This goal requires collaboration of several parties due to its complexity. Onsemi as an end user of the project results guides the development by defining the application, as well as the machine that could be used in the production. iDesyn and DEUV have specific knowledge of building the systems for processing of the SiC and processing of SiC. HiLASE has specific knowledge on high energy/power lasers and due to its experience can build laser systems that is customized for specific applications.