Linear plasma system with a series of hollow cathodes for rapid reactive thin film deposition

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Regime
closed
Category
Preparation of materials > Thin films and coatings
Inclusion to structure
Department of Low-Temperature Plasma
Contact person

Plasma system allows deposition of thin films on large areas with high deposition rate. The process uses reactive sputtering and evaporation of a number of hollow cathodes working with plasma jet channels. The device is suitable for depositing thick semiconducting thin films on flat or porous substrates.